Introduction
Wangling’s F4BME high frequency materials are PTFE glass fiber cloth copper clad laminates that combine glass fiber cloth, PTFE resin, and PTFE film through a meticulous manufacturing process.
These series laminates offer improved electrical performance compared to F4B due to their wider range of dielectric constants, low dielectric loss, increased insulation resistance, and enhanced stability. Consequently, they can serve as replacements for similar foreign products.
F4BME and F4BM share the same dielectric layer, the copper foil used differs between them. F4BME utilizes reversed treated foil (RTF), which offers excellent PIM performance, precise line control, and lower conductor loss.
Features
You have the freedom to select from a diverse range of dielectric constant options, ranging from 2.17 to 3.0. The dissipation factor is within the range of 0.001 to 0.0018. There is a wide array of thickness options available to meet your specific needs, and the variety of sizes offered enables cost savings. These features collectively make it highly suitable for commercial applications, large-scale production, and cost-effective solutions.
PCB Capability
We possess a comprehensive range of PCB manufacturing capabilities that encompass various aspects.
To meet your specific requirements, we can provide Single Sided, Double Sided, Multilayer, and Hybrid PCBs. You have the flexibility to choose between copper weights of 1oz (35µm) and 2oz (70µm) for your needs.
Moreover, we offer a diverse selection of dielectric thickness options, ranging from 0.8mm to 12.0mm, including precise measurements like 1.524mm and 1.575mm.
Our capabilities extend to accommodating PCB sizes up to 400mm X 500mm, ensuring that we can meet your size specifications. In terms of customization, we provide a range of solder mask colors, such as Green, Black, Blue, Yellow, Red, and more, allowing you to personalize the appearance of your PCBs.
Additionally, we offer multiple surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.
| PCB Material: |
PTFE glass fiber cloth copper clad laminates |
| Designation (F4BME ) |
F4BME |
DK |
DF |
| F4BME217 |
2.17±0.04 |
0.0010 |
| F4BME220 |
2.20±0.04 |
0.0010 |
| F4BME233 |
2.33±0.04 |
0.0011 |
| F4BME245 |
2.45±0.05 |
0.0012 |
| F4BME255 |
2.55±0.05 |
0.0013 |
| F4BME265 |
2.65±0.05 |
0.0014 |
| F4BME275 |
2.75±0.05 |
0.0015 |
| F4BME294 |
2.94±0.06 |
0.0017 |
| F4BME300 |
3.00±0.06 |
0.0018 |
| Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (or overall thickness) |
0.102mm, 0.203mm, 0.508mm, 0.762mm, 1.016mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
Applications
The F4BME PCB has a diverse range of applications, including but not limited to phase shifters, passive devices, power dividers, couplers, combiners, feed networks, phased array antennas, satellite communications, base station antennas, and radar systems.
Ваше сообщение должно содержать от 20 до 3000 символов!
