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F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness

МОК: 1 шт.
цена: USD9.99-99.99
Стандартная упаковка: Вакуумные сумки+коробки
Срок доставки: 8-9 рабочих дней
Способ оплаты: Т/Т
Пропускная способность: 5000 шт в месяц
Подробная информация
Место происхождения
Китай
Фирменное наименование
Bicheng
Сертификация
UL, ISO9001, IATF16949
Номер модели
БИК-332.В1.0
Номер детали:
F4BM217
Толщина ламината:
0.1mm-12mm
Размер ламината:
460х610мм 500х600мм 850х120мм 914х1220мм 1000х1200мм
Медный вес:
0,5 унции (0,018 мм) 1 унция (0,035 мм)
Выделить:

0.1mm Copper Clad Laminate

,

BME217 Copper Clad Laminate

,

12mm Copper Clad Laminate

Описание продукта

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Clad with standard Electrodeposited (ED) copper foil. This is a cost-effective solution for standard high-frequency applications where low Passive Intermodulation (PIM) is not critical.


F4BME217: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 1

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Подробная информация о продукции
F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness
МОК: 1 шт.
цена: USD9.99-99.99
Стандартная упаковка: Вакуумные сумки+коробки
Срок доставки: 8-9 рабочих дней
Способ оплаты: Т/Т
Пропускная способность: 5000 шт в месяц
Подробная информация
Место происхождения
Китай
Фирменное наименование
Bicheng
Сертификация
UL, ISO9001, IATF16949
Номер модели
БИК-332.В1.0
Номер детали:
F4BM217
Толщина ламината:
0.1mm-12mm
Размер ламината:
460х610мм 500х600мм 850х120мм 914х1220мм 1000х1200мм
Медный вес:
0,5 унции (0,018 мм) 1 унция (0,035 мм)
Количество мин заказа:
1 шт.
Цена:
USD9.99-99.99
Упаковывая детали:
Вакуумные сумки+коробки
Время доставки:
8-9 рабочих дней
Условия оплаты:
Т/Т
Поставка способности:
5000 шт в месяц
Выделить

0.1mm Copper Clad Laminate

,

BME217 Copper Clad Laminate

,

12mm Copper Clad Laminate

Описание продукта

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Clad with standard Electrodeposited (ED) copper foil. This is a cost-effective solution for standard high-frequency applications where low Passive Intermodulation (PIM) is not critical.


F4BME217: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 1

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