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TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish

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TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish

МОК:	1 шт.
цена:	USD9.99-99.99
Стандартная упаковка:	Вакуумные сумки+коробки
Срок доставки:	8-9 рабочих дней
Способ оплаты:	Т/Т
Пропускная способность:	5000 шт в месяц

Подробности Информация

Описание продукта

Подробная информация

Место происхождения

Китай

Фирменное наименование

Bicheng

Сертификация

UL, ISO9001, IATF16949

Номер модели

БИК-332.В1.0

Базовый материал:

TLY-5

Количество слоев:

2-слойный

Толщина печатной платы:

0,3 мм

Размер печатной платы:

55 мм × 50 мм

Шелковик:

Припаяя маска:

Медный вес:

1 унция (1,4 мила) для внешних слоев

Поверхностная обработка:

Погружение золота

Выделить:

Immersion Gold Finish RF PCB

TLY-5 RF PCB

2 Layer RF PCB

Описание продукта

This 2-layer rigid PCB adopts TLY-5, a dimensionally stable laminate with lightweight woven fiberglass. Specifically engineered to meet rigorous high-frequency RF signal transmission requirements, it is highly applicable to automotive radar and millimeter wave antenna systems.

PCB Specifications

Parameter	Details
Layer Count	2-Layer (rigid structure)
Base Material	TLY-5
Board Dimensions	55mm × 50mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space	6 mils (trace) / 8 mils (space)
Minimum Hole Size	0.2mm
Vias	No blind vias; Total vias: 17; Via plating thickness: 20 μm
Finished Board Thickness	0.3mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Immersion Gold
Silkscreen	No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask	No solder mask on top layer; No solder mask on bottom layer
Quality Assurance	100% electrical test conducted prior to shipment

PCB Stack-up

Layer Name	Material	Thickness
Top Copper Layer (Copper_layer_1)	Copper	35 μm
Substrate Core	TLY-5	0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2)	Copper	35 μm

TLY-5 Material Introduction

TLY-5 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix in the TLY-5 material yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 0

Key Material Features

Feature	Specification/Description
Material Composition	TLY-5 laminate with lightweight woven fiberglass
Dielectric Constant (Dk)	2.2 ± 0.02 at 10 GHz/23°C
Loss Tangent	0.0009 at 10 GHz
Density (Specific Gravity)	2.19 g/cm³
Moisture Absorption	0.02%
Coefficient of Thermal Expansion (CTE)	X axis: 26 ppm/°C; Y axis: 15 ppm/°C; Z axis: 217 ppm/°C

Core Benefits

Dimensional Stability: Superior to chopped fiber reinforced PTFE composites.

Lowest Dissipation Factor (DF): Suitable for 77 GHz automotive radar and millimeter wave applications.

Low Moisture Absorption: Minimizes performance degradation in humid environments.

High Copper Peel Strength: Enhances structural reliability and component bonding.

Uniform & Consistent Dk: Ensures stable electrical performance.

High-Volume Manufacturing Suitability: Mechanically stable for mass production.

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

Typical Applications

-Automotive Radar

-Satellite/Cellular Communications

-Power Amplifiers

-LNBs, LNAs, LNCs

-Aerospace

-Ka, E and W band Applications

Summary

This 2-layer rigid PCB based on TLY-5 substrate is a high-performance solution tailored for high-frequency microwave and RF applications, especially 77 GHz automotive radar. By leveraging TLY-5's superior properties (excellent dimensional stability, lowest dissipation factor, low moisture absorption, uniform Dk), and strict compliance with IPC-Class-2 standards, it effectively meets the rigorous signal transmission requirements of millimeter wave systems.

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 1

Теги:

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

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Ламинированные материалы из меди

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish

МОК:	1 шт.
цена:	USD9.99-99.99
Стандартная упаковка:	Вакуумные сумки+коробки
Срок доставки:	8-9 рабочих дней
Способ оплаты:	Т/Т
Пропускная способность:	5000 шт в месяц

Подробная информация

Описание продукта

Подробная информация

Место происхождения

Китай

Фирменное наименование

Bicheng

Сертификация

UL, ISO9001, IATF16949

Номер модели

БИК-332.В1.0

Базовый материал:

TLY-5

Количество слоев:

2-слойный

Толщина печатной платы:

0,3 мм

Размер печатной платы:

55 мм × 50 мм

Шелковик:

НЕТ

Припаяя маска:

НЕТ

Медный вес:

1 унция (1,4 мила) для внешних слоев

Поверхностная обработка:

Погружение золота

Количество мин заказа:

1 шт.

Цена:

USD9.99-99.99

Упаковывая детали:

Вакуумные сумки+коробки

Время доставки:

8-9 рабочих дней

Условия оплаты:

Т/Т

Поставка способности:

5000 шт в месяц

Выделить

Immersion Gold Finish RF PCB

TLY-5 RF PCB

2 Layer RF PCB

Описание продукта

PCB Specifications

Parameter	Details
Layer Count	2-Layer (rigid structure)
Base Material	TLY-5
Board Dimensions	55mm × 50mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space	6 mils (trace) / 8 mils (space)
Minimum Hole Size	0.2mm
Vias	No blind vias; Total vias: 17; Via plating thickness: 20 μm
Finished Board Thickness	0.3mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Immersion Gold
Silkscreen	No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask	No solder mask on top layer; No solder mask on bottom layer
Quality Assurance	100% electrical test conducted prior to shipment

PCB Stack-up

Layer Name	Material	Thickness
Top Copper Layer (Copper_layer_1)	Copper	35 μm
Substrate Core	TLY-5	0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2)	Copper	35 μm

TLY-5 Material Introduction

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 0

Key Material Features

Feature	Specification/Description
Material Composition	TLY-5 laminate with lightweight woven fiberglass
Dielectric Constant (Dk)	2.2 ± 0.02 at 10 GHz/23°C
Loss Tangent	0.0009 at 10 GHz
Density (Specific Gravity)	2.19 g/cm³
Moisture Absorption	0.02%
Coefficient of Thermal Expansion (CTE)	X axis: 26 ppm/°C; Y axis: 15 ppm/°C; Z axis: 217 ppm/°C

Core Benefits

Dimensional Stability: Superior to chopped fiber reinforced PTFE composites.

Lowest Dissipation Factor (DF): Suitable for 77 GHz automotive radar and millimeter wave applications.

Low Moisture Absorption: Minimizes performance degradation in humid environments.

High Copper Peel Strength: Enhances structural reliability and component bonding.

Uniform & Consistent Dk: Ensures stable electrical performance.

High-Volume Manufacturing Suitability: Mechanically stable for mass production.

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

Typical Applications

-Automotive Radar

-Satellite/Cellular Communications

-Power Amplifiers

-LNBs, LNAs, LNCs

-Aerospace

-Ka, E and W band Applications

Summary

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 1

Теги: