2-Layer High Frequency PCB with 25mil Rogers RO3206 Substrate 0.75mm Thickness and 63mm x 45mm Size

The 2-layer rigid PCB features a precise stack-up designed for optimal signal integrity:

• Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB manufacturing data, ensuring compatibility with production processes
• Accepted Standard: Manufactured to IPC-Class-2 specifications, ensuring high quality and reliability for general electronics applications

Rogers' RO3206 combines ceramic fillers with woven fiberglass reinforcement to deliver a balance of performance and affordability, making it a preferred choice for high-frequency designs. Its enhanced mechanical stability sets it apart within the RO3000 series.

• Dielectric Constant: 6.15 with a tight tolerance of ±0.15 at 10 GHz/23°C, ensuring consistent signal propagation
• Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss at high frequencies
• Thermal Conductivity: 0.67 W/MK, efficient heat dissipation to prevent overheating
• Moisture Absorption: Less than 0.1%, maintaining performance in humid environments
• CTE Matching: Coefficient of thermal expansion (CTE) matched to copper (X-axis: 13 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 34 ppm/°C), reducing thermal stress during temperature fluctuations
• Copper Peel Strength: 10.7 lbs/in, ensuring strong adhesion between copper layers and the substrate for long-term reliability

• Woven Glass Reinforcement: Enhances rigidity, making the board easier to handle during assembly and reducing the risk of damage
• Uniform Performance: Consistent electrical and mechanical properties across the board, ideal for complex high-frequency structures
• Low Dielectric Loss: Enables superior high-frequency performance, critical for applications like wireless communications
• Low In-Plane Expansion: CTE matched to copper supports compatibility with epoxy multilayer hybrid designs and ensures reliable surface-mounted assemblies
• Dimensional Stability: Excellent stability leads to high production yields, reducing manufacturing costs
• Cost-Effectiveness: Economically priced, suitable for volume manufacturing without compromising quality
• Surface Smoothness: Allows for finer line etching tolerances, supporting the precise routing of small traces

This PCB is well-suited for a diverse range of applications, including:

• Automotive collision avoidance systems and global positioning satellite antennas
• Wireless telecommunications systems and microstrip patch antennas
• Direct broadcast satellites and datalink on cable systems
• Remote meter readers and power backplanes
• LMDS (Local Multipoint Distribution Service) and wireless broadband infrastructure
• Base station equipment for telecommunications networks