МОК: | 1 шт |
цена: | USD9.99-99.99 |
Стандартная упаковка: | Вакуумные сумки+коробки |
Срок доставки: | 8-9 рабочих дней |
Способ оплаты: | T/T. |
Пропускная способность: | 5000 шт в месяц |
Parameter | Details |
---|---|
Base Material | Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability. |
Layer Count | 4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality. |
Board Dimensions | 60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit. |
Minimum Trace/Space | 4/5 mils, enabling fine signal routing critical for high-frequency operations. |
Minimum Hole Size | 0.4mm, accommodating small components and ensuring reliable interconnections. |
Finished Board Thickness | 4.8mm, providing robust structural integrity for demanding applications. |
Finished Copper Weight | 1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling. |
Surface Finish | Electroless Nickel Immersion Gold (ENIG), offering excellent corrosion resistance, solderability, and stable electrical contact. |
Silkscreen | Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer. |
Solder Mask | No solder mask on either top or bottom layers. |
Special Features | Includes countersunk holes (conical, 90-degree) for secure mounting. |
Quality Assurance | Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications. |
Layer | Specification |
---|---|
Copper Layer 1 | 35 μm, providing a solid conductive path for high-frequency signals. |
Rogers 4003C Core | 0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties. |
Copper Layer 2 | 35 μm, facilitating intermediate signal routing. |
Prepreg RO4450F (x2) | 0.204mm total thickness, ensuring reliable adhesion between layers. |
Rogers 4003C Core | 1.524mm (60mil) thickness, serving as a central insulating layer. |
Prepreg RO4450F (x2) | 0.204mm total thickness, maintaining layer bonding. |
Rogers 4003C Core | 1.524mm (60mil) thickness, enhancing structural rigidity and insulation. |
Prepreg RO4450F (x2) | 0.204mm total thickness, ensuring layer integrity. |
Copper Layer 3 | 35 μm, supporting additional signal and power routing. |
Rogers 4003C Core | 0.508mm (20mil) thickness, forming the bottom insulating layer. |
Copper Layer 4 | 35 μm, mirroring the top layer for balanced electrical performance. |
МОК: | 1 шт |
цена: | USD9.99-99.99 |
Стандартная упаковка: | Вакуумные сумки+коробки |
Срок доставки: | 8-9 рабочих дней |
Способ оплаты: | T/T. |
Пропускная способность: | 5000 шт в месяц |
Parameter | Details |
---|---|
Base Material | Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability. |
Layer Count | 4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality. |
Board Dimensions | 60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit. |
Minimum Trace/Space | 4/5 mils, enabling fine signal routing critical for high-frequency operations. |
Minimum Hole Size | 0.4mm, accommodating small components and ensuring reliable interconnections. |
Finished Board Thickness | 4.8mm, providing robust structural integrity for demanding applications. |
Finished Copper Weight | 1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling. |
Surface Finish | Electroless Nickel Immersion Gold (ENIG), offering excellent corrosion resistance, solderability, and stable electrical contact. |
Silkscreen | Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer. |
Solder Mask | No solder mask on either top or bottom layers. |
Special Features | Includes countersunk holes (conical, 90-degree) for secure mounting. |
Quality Assurance | Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications. |
Layer | Specification |
---|---|
Copper Layer 1 | 35 μm, providing a solid conductive path for high-frequency signals. |
Rogers 4003C Core | 0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties. |
Copper Layer 2 | 35 μm, facilitating intermediate signal routing. |
Prepreg RO4450F (x2) | 0.204mm total thickness, ensuring reliable adhesion between layers. |
Rogers 4003C Core | 1.524mm (60mil) thickness, serving as a central insulating layer. |
Prepreg RO4450F (x2) | 0.204mm total thickness, maintaining layer bonding. |
Rogers 4003C Core | 1.524mm (60mil) thickness, enhancing structural rigidity and insulation. |
Prepreg RO4450F (x2) | 0.204mm total thickness, ensuring layer integrity. |
Copper Layer 3 | 35 μm, supporting additional signal and power routing. |
Rogers 4003C Core | 0.508mm (20mil) thickness, forming the bottom insulating layer. |
Copper Layer 4 | 35 μm, mirroring the top layer for balanced electrical performance. |