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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

МОК:	1 шт.
цена:	USD9.99-99.99
Стандартная упаковка:	Вакуумные сумки+коробки
Срок доставки:	8-9 рабочих дней
Способ оплаты:	Т/Т
Пропускная способность:	5000 шт в месяц

Подробности Информация

Описание продукта

Подробная информация

Место происхождения

Китай

Фирменное наименование

Bicheng

Сертификация

UL, ISO9001, IATF16949

Номер модели

БИК-332.В1.0

Базовый материал:

Rogers RO4350B Низкопрофильный (LoPro)

Количество слоев:

2 слоя

Толщина печатной платы:

1,6 мм

Размер печатной платы:

43 мм х 56 мм за штуку (1 шт.)

Шелковик:

Белый

Припаяя маска:

Зеленый

Медный вес:

1 унция (1,4 мила) для внешних слоев

Чистота поверхности:

ENEPIG (химический никель, химический палладий и иммерсионное золото)

Выделить:

LoPro RO4350B PCB board

Double-sided Rogers PCB 1.6mm

ENEPIG finish PCB board

Описание продукта

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.

PCB Specification

Parameter	Details
Base Material	Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count	2-Layer (rigid structure)
Board Dimensions	43mm x 56mm per piece (1PCS)
Minimum Trace/Space	4 mils (trace) / 6 mils (space)
Minimum Hole Size	0.3mm
Vias	No blind vias; via plating thickness = 20 μm
Finished Board Thickness	1.6mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen	White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing before shipment

PCB Stack-up

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO4350B LoPro	1.542mm (60.7mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO4350B Low Profile Material

Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:

FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.

Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.

Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.

Key Material Features

Feature	Specification
Dielectric Constant (Dk)	3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF)	0.0037 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >390°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.69 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 10 ppm/°C - Y-axis: 12 ppm/°C - Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating	UL 94-V0
Additional Attributes	CAF (Conductive Anodic Filament) resistant; lead-free compatible

Core Benefits

Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.

Some Typical Applications

Digital applications such as servers, routers, and high speed back planes
Cellular base station antennas and power amplifiers
LNB's for direct broadcast satellites
RF Identification Tags

Summary

The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.

Теги:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

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PCB ядра металла

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

МОК:	1 шт.
цена:	USD9.99-99.99
Стандартная упаковка:	Вакуумные сумки+коробки
Срок доставки:	8-9 рабочих дней
Способ оплаты:	Т/Т
Пропускная способность:	5000 шт в месяц

Подробная информация

Описание продукта

Подробная информация

Место происхождения

Китай

Фирменное наименование

Bicheng

Сертификация

UL, ISO9001, IATF16949

Номер модели

БИК-332.В1.0

Базовый материал:

Rogers RO4350B Низкопрофильный (LoPro)

Количество слоев:

2 слоя

Толщина печатной платы:

1,6 мм

Размер печатной платы:

43 мм х 56 мм за штуку (1 шт.)

Шелковик:

Белый

Припаяя маска:

Зеленый

Медный вес:

1 унция (1,4 мила) для внешних слоев

Чистота поверхности:

ENEPIG (химический никель, химический палладий и иммерсионное золото)

Количество мин заказа:

1 шт.

Цена:

USD9.99-99.99

Упаковывая детали:

Вакуумные сумки+коробки

Время доставки:

8-9 рабочих дней

Условия оплаты:

Т/Т

Поставка способности:

5000 шт в месяц

Выделить

LoPro RO4350B PCB board

Double-sided Rogers PCB 1.6mm

ENEPIG finish PCB board

Описание продукта

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

PCB Specification

Parameter	Details
Base Material	Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count	2-Layer (rigid structure)
Board Dimensions	43mm x 56mm per piece (1PCS)
Minimum Trace/Space	4 mils (trace) / 6 mils (space)
Minimum Hole Size	0.3mm
Vias	No blind vias; via plating thickness = 20 μm
Finished Board Thickness	1.6mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen	White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing before shipment

PCB Stack-up

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO4350B LoPro	1.542mm (60.7mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO4350B Low Profile Material

FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.

Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.

Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.

Key Material Features

Feature	Specification
Dielectric Constant (Dk)	3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF)	0.0037 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >390°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.69 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 10 ppm/°C - Y-axis: 12 ppm/°C - Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating	UL 94-V0
Additional Attributes	CAF (Conductive Anodic Filament) resistant; lead-free compatible

Core Benefits

Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.

Some Typical Applications

Digital applications such as servers, routers, and high speed back planes
Cellular base station antennas and power amplifiers
LNB's for direct broadcast satellites
RF Identification Tags

Summary

Теги: