| МОК: | 1 шт. |
| цена: | USD9.99-99.99 |
| Стандартная упаковка: | Вакуумные сумки+коробки |
| Срок доставки: | 8-9 рабочих дней |
| Способ оплаты: | Т/Т |
| Пропускная способность: | 5000 шт в месяц |
| Parameter | Specification |
|---|---|
| Layer Count | 2-layer rigid PCB |
| Base Material | Astra MT77 |
| Board Dimensions | 48.5mm x 43.3mm (1 piece), tolerance ±0.15mm |
| Finished Board Thickness | 0.33mm |
| Finished Copper Weight | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.2mm |
| Vias | 21 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: Green |
| Quality Assurance | 100% Electrical test prior to shipment |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
| Layer Sequence | Layer Type | Specification | Thickness |
|---|---|---|---|
| 1 | Copper Layer (Top - L1) | Copper_layer_1 | 35μm (1oz) |
| 2 | Base Material | Astra MT77 | 0.254mm (10mil) |
| 3 | Copper Layer (Bottom - L2) | Copper_layer_2 | 35μm (1oz) |
| Property | Specification |
|---|---|
| Dielectric Constant (Dk) | 3.0 (2GHz/23°C; 10GHz/23°C) |
| Dissipation Factor (Df) | 0.0017 (2GHz; 10GHz) |
| Peel Strength (1oz Copper) | 5.7 lb/inch |
| Moisture Absorption | 0.1% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 250-350 ppm/°C |
| Glass Transition Temperature (Tg) | 200°C (DSC method) |
| Flammability Rating | UL 94-V0 |
| Process Compatibility | Lead-free compatible |
| МОК: | 1 шт. |
| цена: | USD9.99-99.99 |
| Стандартная упаковка: | Вакуумные сумки+коробки |
| Срок доставки: | 8-9 рабочих дней |
| Способ оплаты: | Т/Т |
| Пропускная способность: | 5000 шт в месяц |
| Parameter | Specification |
|---|---|
| Layer Count | 2-layer rigid PCB |
| Base Material | Astra MT77 |
| Board Dimensions | 48.5mm x 43.3mm (1 piece), tolerance ±0.15mm |
| Finished Board Thickness | 0.33mm |
| Finished Copper Weight | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.2mm |
| Vias | 21 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: Green |
| Quality Assurance | 100% Electrical test prior to shipment |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
| Layer Sequence | Layer Type | Specification | Thickness |
|---|---|---|---|
| 1 | Copper Layer (Top - L1) | Copper_layer_1 | 35μm (1oz) |
| 2 | Base Material | Astra MT77 | 0.254mm (10mil) |
| 3 | Copper Layer (Bottom - L2) | Copper_layer_2 | 35μm (1oz) |
| Property | Specification |
|---|---|
| Dielectric Constant (Dk) | 3.0 (2GHz/23°C; 10GHz/23°C) |
| Dissipation Factor (Df) | 0.0017 (2GHz; 10GHz) |
| Peel Strength (1oz Copper) | 5.7 lb/inch |
| Moisture Absorption | 0.1% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 250-350 ppm/°C |
| Glass Transition Temperature (Tg) | 200°C (DSC method) |
| Flammability Rating | UL 94-V0 |
| Process Compatibility | Lead-free compatible |