RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet

RT/duroid 6202PR is a high-frequency circuit material engineered as a low-loss, low-dielectric-constant laminate. It combines superior electrical and mechanical properties essential for designing complex microwave structures that demand both mechanical reliability and electrical stability, and is specifically suited for planar resistor applications.

The incorporation of limited woven glass reinforcement achieves excellent dimensional stability (0.05 to 0.07 mils/inch), enabling the production of tight-tolerance planar resistors.

Cladding Options and Dielectric Thicknesses

A wide range of copper cladding options is available on standard dielectric thicknesses of 0.005" (0.127mm), 0.010" (0.254mm), 0.015" (0.381mm), and 0.020" (0.508mm):

Electrodeposited copper foil: ¼ oz. to 2 oz./ft.²

Rolled copper foil: ½ oz., 1 oz., and 2 oz.

Reverse-treated foil: ½ oz., 1 oz., and 2 oz.

Electrodeposited copper foil with a resistive layer: ½ oz. and 1 oz.

For applications requiring non-reinforced material, RT/duroid 6002PR is available in 0.020" and 0.030" dielectric thicknesses.

Features and Benefits

• Low Loss: Delivers excellent high-frequency performance.
• Excellent Mechanical and Electrical Properties: Enables reliable multi-layer board constructions.
• Tight Dielectric Constant and Thickness Controls: Ensures consistent electrical performance.
• Extremely Low Thermal Coefficient of Dielectric Constant: Ideal for applications sensitive to temperature change; maintains electrical stability across a wide temperature range.
• Excellent Dimensional Stability: Allows for the manufacture of high-precision circuits; the in-plane expansion coefficient is matched to copper.
• Coefficient of Thermal Expansion (CTE) Matched to Copper: Allows for more reliable surface-mounted assemblies and plated through-holes.

Typical Applications

• Phased Array Antennas
• Ground-Based and Airborne Radar Systems
• Global Positioning System (GPS) Antennas
• Power Backplanes
• High-Reliability Complex Multi-layer Circuits
• Commercial Airline Collision Avoidance Systems
• Beam Forming Networks