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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

МОК: 1 шт.
цена: USD9.99-99.99
Стандартная упаковка: Вакуумные пакеты+коробки
Срок доставки: 8-9 рабочих дней
Способ оплаты: Т/Т
Пропускная способность: 5000ПК в месяц
Подробная информация
Место происхождения
Китай
Фирменное наименование
Bicheng
Сертификация
UL, ISO9001, IATF16949
Номер модели
БИК-332.В1.0
Номер детали:
TLY-3
Толщина ламината:
0,0035 дюйма; 0,0050 дюйма; 0,0075 дюйма; 0,0100 дюйма
Размер ламината:
12 х 18 дюймов (305 х 457 мм); 16 х 36 дюймов (406 х 914 мм); 16 х 18 дюймов (406 х 457 мм); 24 х 36
Медная масса:
1/2 унции. Медь ЭД; 1 унция. Медь CL1; 1 унция. C1 коппе
Выделить:

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Описание продукта

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
продукты
Подробная информация о продукции
PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
МОК: 1 шт.
цена: USD9.99-99.99
Стандартная упаковка: Вакуумные пакеты+коробки
Срок доставки: 8-9 рабочих дней
Способ оплаты: Т/Т
Пропускная способность: 5000ПК в месяц
Подробная информация
Место происхождения
Китай
Фирменное наименование
Bicheng
Сертификация
UL, ISO9001, IATF16949
Номер модели
БИК-332.В1.0
Номер детали:
TLY-3
Толщина ламината:
0,0035 дюйма; 0,0050 дюйма; 0,0075 дюйма; 0,0100 дюйма
Размер ламината:
12 х 18 дюймов (305 х 457 мм); 16 х 36 дюймов (406 х 914 мм); 16 х 18 дюймов (406 х 457 мм); 24 х 36
Медная масса:
1/2 унции. Медь ЭД; 1 унция. Медь CL1; 1 унция. C1 коппе
Количество мин заказа:
1 шт.
Цена:
USD9.99-99.99
Упаковывая детали:
Вакуумные пакеты+коробки
Время доставки:
8-9 рабочих дней
Условия оплаты:
Т/Т
Поставка способности:
5000ПК в месяц
Выделить

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

Описание продукта

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
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